Hanbo
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With Film/Frame Wafer inspection system

keywords: 3D inspection, IC warpage

Category：

Semiconductor EFEM system

Hanbo

Tel：

0512-83556815

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Details

The main function:

wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible

 

Features:

Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)

 

Application method:

Can be used with various equipment for transmission such as

Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment

 

 

 

 

Product Size

8” or 12” wafer with film/iron frame (before and after cutting)

camera

CMOS 10 million pixels

optical resolution

0.5X ~ 10X, microscope objective lens, *can be combined with other optical systems

barcode reading

Barcode reading function

Product thickness

6 mil ~12 mil（Other styles can be customized）

Product warpage

Below 2 mm (Other styles can be customized separately)

Input and output form

Loading/Unloading Cassette* 1（same in and out form)

Control System

PLC

exercise system

Axis control motor system

physical dimension

3200 mm × 1900mm × 2200mm （estimated value）

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