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Fully Automatic Labeling and Self-Inspection Equipment


keywords: 3D inspection, IC warpage

Category:

Imaging measurement equipment

Details


The main function:

wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible

 

Features:

Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)

 

Application method:

Can be used with various equipment for transmission such as

Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment

Keywords:

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