AVI Image Inspection Equipment
keywords: 3D inspection, IC warpage
Category：
Semiconductor equipment
Tel：
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
Main Features:
● Employs a 6-axis robotic arm for multi-point AI inspection of the product surface.
● Dual control system, using PC+PLC mode, ensures simultaneous inspection and image acquisition.
● Utilizes a high-resolution, high-resolution industrial-grade color CCD to ensure high-quality measurement images.
Equipment Parameters:
Applicable Scenarios:
Widely applicable in the following industries for detecting surface defects, dirt, scratches, etc. on component panels:
● 3C Industry: Surface defect inspection of mobile phone/computer shells, display glass, keyboard panels, etc.
● Electronics and Semiconductors: Precision inspection of PCB pad oxidation, chip packaging cracks, wafer surface scratches, etc.
● Automotive Parts: Burrs and paint defects inspection on instrument panel panels, car light housings, metal trim.
● New Energy Field: Scratch detection on photovoltaic module glass covers, dents on lithium battery shells, stain detection on energy storage equipment panels.
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Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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