Film/Framed Wafer Inspection System
The main function is to inspect the Wafer surface through the principle of laser and confocal optics. It can measure Particles with a size of 0.3um and calculate the height of nanometers. It also integrates the exclusive designed Frame Wafer automatic loading and unloading system.
keywords: 3D inspection, IC warpage
Category：
Measurement/Detection System
Tel：
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
Keywords：
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Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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