Packaged IC 3D measurement system
The automated 3D inspection equipment designed for packaged ICs can automate the loading and unloading of trays, automatic sorting and sorting, and can calculate solder ball coplanarity, ball height, and IC warpage.
keywords: 3D inspection, IC warpage
Category：
Customized Project
Tel：
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
Keywords：
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Wafer Thickness/IR Inspection System
Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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