Wafer Thickness/IR Inspection System
This is a composite optical measurement system that integrates laser and IR systems for measurement, including the following functions: Wafer cutting line IR detection; penetrating multi-layer film thickness measurement; Wafer thickness, TTV, WARP.
keywords: 3D inspection, IC warpage
Category：
Customized Project
Tel：
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
Keywords：
Next
Prev
None
Next
Contact：17715518125
-
E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
Scan to follow us
Copyright ©2022 Jiangsu Hanbo Intelligent Equipment Manufacturing Co., Ltd.