3D Intelligent Profile measurement instrument
Height measurement can be performed from high-precision metal processing to Wafer 3D microstructure, and surface profile measurement can be performed according to selection;The latest high-end models can perform wafer BOW, WARP, TTV, LTV； EFEM OCR/Pre-Aligner is optional.
keywords: 3D inspection, IC warpage
Category：
Measurement/Detection System
Tel：
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
Keywords：
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Wafer Defect Inspection Machine
Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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