Hanbo
+
  • e1.jpg

Sorting / Transfer Equipment

Manipulators are used to operate wafers, and various standard wafer cassettes and sizes (6/8 inches and 8/12 inches) can be selected; OCR/Pre-Aligner is optional.

keywords: 3D inspection, IC warpage

Category：

Semiconductor EFEM system

Hanbo

Tel：

0512-83556815

Cntact
Messages

Details

The main function:

wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible

 

Features:

Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)

 

Application method:

Can be used with various equipment for transmission such as

Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment

 

 

 

Item

Content

Specification

1

Wafer size

1.12” shared with 8”
2.8” shared with 6”
3.6” shared with 4”

2

Wafer Thickness

400um~1200um

3

Warping

<3mm,
Other specifications can be ordered

4

Number of clips

2~4 pcs,
Other specifications can be requested separately

5

Clip form

12” : FOUB, FOSB,PFA 6” and 8” : Open PP, PFA, Metal (other forms can be negotiated)

6

Edge Finding
(optional)

Accuracy: ± 0.1mm
Angle: ± 0.1’
Speed: <3.5s

7

OCR (optional)

IOSS

8

Reclaiming arm

Yaskawa : five axis
Accuracy: ± 0.1mm

9

WPH

> 350~550WPH (according to alignment and OCR requirements)

10

Dust-free grade

Class 10

11

Utilization rate

>98%

12

MTBF

>1000 hours

13

MTTR

<3 hours

 

Keywords：

Prev

None

Desktop Conveyor

Next

Prev

Desktop Conveyor

Next

Desktop Conveyor

Wafer Thickness/IR Inspection System

Wafer Thickness/IR Inspection System

+
Packaged IC 3D measurement system

Packaged IC 3D measurement system

+
Wafer micro inspection system

Wafer micro inspection system

+