Wafer micro inspection system
Microscopic defect detection for Wafer, can be used with different feeding systems, can be used with 20X lens to detect 1um defects; optional EFEM, OCR/Pre-Aligner; Wafer semi-finished/finished OQC; SiC / GaN / GaAs / Si / sapphire; Compatible with VCSEL / MEMs / Mini LED / Micro LED; Microscopic objective lens (Nikon 5X~50X) is also available.
keywords: 3D inspection, IC warpage
Category：
Measurement/Detection System
Tel：
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
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Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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