AVI Image Inspection Equipment
keywords: 3D inspection, IC warpage
Category:
Semiconductor equipment
Tel:
Details
The main function:
wafer transfer
edge alignment
Juguan personnel inspection: 360-degree rotation
Crystal back inspection: reversible
Features:
Applied to the third generation semiconductor materials
Overcome the edge-finding alignment of transparent and translucent materials
Capable of transporting thinned wafers (>80um)
Application method:
Can be used with various equipment for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measurement equipment
Film Thickness Measuring Instrument
Wafer AOI equipment
4PP probe measuring equipment
Laser marking equipment
Main Features:
● AI detection software, independently developed based on deep learning, reduces overkill in complex scenarios.
● High-precision vertical ring module, secondary positioning accuracy ±0.07MM.
● Multi-station continuous ring uses 10 stations for continuous operation, improving inspection efficiency.
● Dual control system, using PC+PLC mode, easily interfaces with MES.
● High-resolution, high-definition industrial color CCD, ensuring high-quality measurement images.
● Programmable LED cold light source, providing multiple brightness adjustments.
● Product surface phase acquisition and storage, using dual-station mode, inspection and phase acquisition without interference.
● Multi-point inspection, using six-axis robotic arm equipped with CCD for multi-point surface inspection of products.
Equipment Parameters:
Applicable Scenarios:
Widely applicable in the following industries for detecting surface defects, dirt, scratches, etc. on component panels:
● 3C Industry: Surface defect inspection of mobile phone/computer shells, display glass, keyboard panels, etc.
● Electronics and Semiconductors: Precision inspection of PCB pad oxidation, chip packaging cracks, wafer surface scratches, etc.
● Automotive Parts: Burrs and paint defects inspection on instrument panel panels, car light housings, metal trim.
● New Energy Field: Scratch detection on photovoltaic module glass covers, dents on lithium battery shells, stain detection on energy storage equipment panels.
Keywords:
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