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Packaged IC 3D measurement system

Afghanistan Packaged IC 3D measurement system

The automated 3D inspection equipment designed for packaged ICs can automate the loading and unloading of trays, automatic sorting and sorting, and can calculate solder ball coplanarity, ball height, and IC warpage.

Wafer Thickness/IR Inspection System

Afghanistan Wafer Thickness/IR Inspection System

This is a composite optical measurement system that integrates laser and IR systems for measurement, including the following functions: Wafer cutting line IR detection; penetrating multi-layer film thickness measurement; Wafer thickness, TTV, WARP.

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