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The main function is to inspect the Wafer surface through the principle of laser and confocal optics. It can measure Particles with a size of 0.3um and calculate the height of nanometers. It also integrates the exclusive designed Frame Wafer automatic loading and unloading system.
Height measurement can be performed from high-precision metal processing to Wafer 3D microstructure, and surface profile measurement can be performed according to selection;The latest high-end models can perform wafer BOW, WARP, TTV, LTV； EFEM OCR/Pre-Aligner is optional.
It is specially designed for the detection of nano-scale defects, and can detect the particle size of 0.1um. It also includes an image re-inspection system; EFEM OCR/Pre-Aligner is optional.
Microscopic defect detection for Wafer, can be used with different feeding systems, can be used with 20X lens to detect 1um defects; optional EFEM, OCR/Pre-Aligner; Wafer semi-finished/finished OQC; SiC / GaN / GaAs / Si / sapphire; Compatible with VCSEL / MEMs / Mini LED / Micro LED; Microscopic objective lens (Nikon 5X~50X) is also available.
Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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