central africa Sorting / Transfer Equipment

Manipulators are used to operate wafers, and various standard wafer cassettes and sizes (6/8 inches and 8/12 inches) can be selected; OCR/Pre-Aligner is optional.

Product Description

 

 

 

Item

Content

Specification

1

Wafer size

1.12” shared with 8”
2.8” shared with 6”
3.6” shared with 4”

2

Wafer Thickness

400um~1200um

3

Warping

<3mm,
Other specifications can be ordered

4

Number of clips

2~4 pcs,
Other specifications can be requested separately

5

Clip form

12” : FOUB, FOSB,PFA 6” and 8” : Open PP, PFA, Metal (other forms can be negotiated)

6

Edge Finding
(optional)

Accuracy: ± 0.1mm
Angle: ± 0.1’
Speed: <3.5s

7

OCR (optional)

IOSS

8

Reclaiming arm

Yaskawa : five axis
Accuracy: ± 0.1mm

9

WPH

> 350~550WPH (according to alignment and OCR requirements)

10

Dust-free grade

Class 10

11

Utilization rate

>98%

12

MTBF

>1000 hours

13

MTTR

<3 hours