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Oman Packaged IC 3D measurement system
The automated 3D inspection equipment designed for packaged ICs can automate the loading and unloading of trays, automatic sorting and sorting, and can calculate solder ball coplanarity, ball height, and IC warpage.
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Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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