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Wafer micro inspection system
Wafer micro inspection system

Japan Wafer micro inspection system

Microscopic defect detection for Wafer, can be used with different feeding systems, can be used with 20X lens to detect 1um defects; optional EFEM, OCR/Pre-Aligner; Wafer semi-finished/finished OQC; SiC / GaN / GaAs / Si / sapphire; Compatible with VCSEL / MEMs / Mini LED / Micro LED; Microscopic objective lens (Nikon 5X~50X) is also available.

Category:

JapanMeasurement/Detection System

Phone:400-888-8888

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Product Description

 

Product Size

6”/8” and 8”/12”wafer (before and after cutting/with film/with iron frame)

Camera

CMOS 10 million pixels

Optical resolution

1~10 um (resolution can be specified within the selected range)

Types of defects detected

Full wafer visual inspection: scratches, stains, peeling, broken... etc.

Light source

High brightness multi-angle light source

Character code reading

OCR character code recognition and reading, automatic positive positioning

Product thickness

6 mil ~12 mil (other styles can be customized separately)

Product warpage

Below 2 mm (Other styles can be customized separately)

Input and output form

Loading/Unloading Cassette* 2 ~ 4（same in and out form)

Computer system

4~8 sets/Windows

Exercise system

Axis control motor system

Detection speed

70WPH @ 8寸,3.75X (2.4um)

Report function

Wafer Macro Defect Map、Inspection Results

Physical dimension

3000 mm × 1900mm × 2200mm （estimated value）

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