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Finland Wafer Thickness/IR Inspection System
This is a composite optical measurement system that integrates laser and IR systems for measurement, including the following functions: Wafer cutting line IR detection; penetrating multi-layer film thickness measurement; Wafer thickness, TTV, WARP.
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Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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