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3D Intelligent Profile measurement instrument
3D Intelligent Profile measurement instrument

Bhutan 3D Intelligent Profile measurement instrument

Height measurement can be performed from high-precision metal processing to Wafer 3D microstructure, and surface profile measurement can be performed according to selection;The latest high-end models can perform wafer BOW, WARP, TTV, LTV； EFEM OCR/Pre-Aligner is optional.

Category:

BhutanMeasurement/Detection System

Phone:400-888-8888

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Product Description

 

Project

Specification

Operation method

electric

XY platform travel (mm)

300 x200

Z-axis travel (Z) (mm)

50

Loading weight(kg)

5

Measurable stroke(mm)

300 x 300 x 50

Instrument weight(kg)

100

Height display resolution (um)

0.1

Z direction repeatability (um)

0.3~2 (according to requirements)

Optical Ruler

X, Y, Z three-axis resolution 1μm

XY axis linear accuracy

(2+L/150)μm

repeatability

2μm

use environment

Temperature 22°C ± 3°C, Humidity 50 ± 5%

 

Measurement Items: Height Step; Dimension Measurement Size; Wafer Thickness Thickness /TTV; Wafer Flatness/ Stress; Wafer Warp BOW/Warp;

 

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