Wafer Thickness/IR Inspection System

central africa Wafer Thickness/IR Inspection System

This is a composite optical measurement system that integrates laser and IR systems for measurement, including the following functions: Wafer cutting line IR detection; penetrating multi-layer film thickness measurement; Wafer thickness, TTV, WARP.

With Film/Frame Wafer inspection system

central africa With Film/Frame Wafer inspection system

3D Intelligent Profile measurement instrument

central africa 3D Intelligent Profile measurement instrument

Height measurement can be performed from high-precision metal processing to Wafer 3D microstructure, and surface profile measurement can be performed according to selection;The latest high-end models can perform wafer BOW, WARP, TTV, LTV； EFEM OCR/Pre-Aligner is optional.

Wafer Defect Inspection Machine

central africa Wafer Defect Inspection Machine

It is specially designed for the detection of nano-scale defects, and can detect the particle size of 0.1um. It also includes an image re-inspection system; EFEM OCR/Pre-Aligner is optional.

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