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The main function is to inspect the Wafer surface through the principle of laser and confocal optics. It can measure Particles with a size of 0.3um and calculate the height of nanometers. It also integrates the exclusive designed Frame Wafer automatic loading and unloading system.
The automated 3D inspection equipment designed for packaged ICs can automate the loading and unloading of trays, automatic sorting and sorting, and can calculate solder ball coplanarity, ball height, and IC warpage.
Contact：17715518125
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E-mail：Sales@hb-gmose.com
Fax：0512-65308125 -
Address: Room 303, Building 1, No. 3 Xialita Road, Mudu Town, Wuzhong District, Suzhou
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